Reflow

Solder paste reflow and glue hardening is processed in a SMT reflow oven. It is a convection oven using hot air for soldering.

SMT 1.7 TC Reflow Oven

• Convection heating
• A unique, patented heating system via nozzles, a so-called “Slot Nozzle System” is a very effective system of heat transfer that enables soldering of lead-free alloys and all common circuit structures including BGA.
• Maximum temperature 350°C
• Belt conveyor width 460mm
• Option of specific temperature profile setting