Automatic Assembling Machines

Assembleon and Yamaha machines by Philips Electronics and Yamaha Motor Co. are used for assembling of SMD components. The Assembleon Company has more than three decades´ experience in the development and production of assembly equipment for electronics industries and is acknowledged as a true performance leader. Yamaha Company cooperates with Assembleon since 1994 and now expands to European market with own brand assembling machines.

The production lines are built with an emphasis on maximum production flexibility while maintaining great performance. The production machines are TOPAZ-X, OPAL-X units which can work independently or in-line and YAMAHA YS units which form a fast line for larger production series.

Real mounting capability of the first line is at about 28,000 cph. Real mounting capability of the second line is at about 30.000 cph.

Assembleon TOPAZ-X-SF Surface Mounter

• Eight-head design
• Optic alignment accuracy components
• Placement speed under IPC 9850 at 15,000 cph
• SMD packages size from 0201
• Dimensions of processed PCB  from 50 x 50 mm up 460 x 440 x 4 mm

Assembleon TOPAZ-XII FNC Surface Mounter

• Eight-head design with nozzle exchange on-the-fly
• Optic alignment accuracy of components
• Placement speed under IPC 9850 at 16,000 cph
• SMD packages size from 0201
• Dimensions of processed PCB are from 50×50 mm up to 460×440×4 mm

Assembleon OPAL-XII Surface Mounter

• Four-head design
• Optic alignment accuracy of components
• Placement speed under IPC 9850 at 12,000 cph
• SMD packages size from 0201
• Dimensions of processed PCB are from 50×50 mm up to 460×440×4 mm

Yamaha YS24X Surface Mounter

• Two portal system, each having ten-heads (nozzles)
• Optic alignment accuracy of components
• Placement speed under IPC 9850 at 30,000 cph
• SMD packages size from 01005 to 45×45 mm and a maximum height of 15 mm
• Dimensions of processed PCB are from 50×50 mm up to 700×460×4 mm

Yamaha YS12F Surface Mounter

• Five-head design
• Optic alignment accuracy of components
• Placement speed under IPC 9850 at 14,000 cph
• SMD packages size from 01005 to 45×100 mm and a maximum height of 15 mm
• Dimensions of processed PCB are from 50×50 mm up to 510×460×4 mm

Communication between single machines is ensured by a SMEMA interface that controls motion of the conveyors between the assembling machines automatically.