Cleaning system

Cleaning of assembled PCBs from chemical residues and mechanical impurities that remain on the board after soldering and handling, or screen printing foils contaminated with dried solder paste or glue, is performed on the SUPERSWASH III automatic washing machine.

The most common use cases:
- washing of assembled boards - contact pads from flux residues
- washing the assembled boards before the coating process
- cleaning unmounted boards after miss-printing of solder paste or glue
- cleaning the screen printing stencils from solder paste or glue residues

 Fully automatic spray-in-air closed loop zero drain system SUPERSWASH III

• Single-chamber large-capacity cleaning system
• Linear direct spray and direct air knife technology
• Max. size of the washing surface (w x d x h) = 815 x 835 x 150 mm
• 4 stages of the washing process: 1) washing (cleaning medium 60° C)
                                                        2) 1st rinse (DI water)
                                                        3) 2nd rinse (DI water)
                                                        4) drying (hot air)
• Also suitable for washing "high density" boards with "low standoff" packages BGA, CSP, QFN ...
• Parameterization, optimization, repeatability of the washing process
• Monitoring the quality of the cleaning and rinsing bath allows washing to a defined cleanliness
• traceability of the solder paste or glue washing process