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Solder paste reflow and glue hardening is processed in a SMT reflow oven. It is a convection oven using hot air for soldering.
SMT 1.7 TC Reflow Oven
A unique, patented heating system via nozzles, a so-called “Slot Nozzle System” is a very effective system of heat transfer that enables soldering of lead-free alloys and all common circuit structures including BGA.