Technologies 

To ensure the high quality of the final product, custom-made electronics are produced in our company using the following well-proven technologies in the individual operations of the production phase:
> application of soldering paste or glue to DPS on manual screen printing equipment or on MONOPRINT AVL automatic equipment through stainless plots made by laser technology;
> surface mounting of components using the Surface Mount Technology (SMT) on automatic OPAL – X II 4head,TOPAZ – X SF and TOPAZ X II FNC “pick and place” equipment types;
> remelting soldering pastes in a REFLOW SMT 1.7 TC soldering furnace;
> in-process MIRTEC MV2HTL optical inspection and automatic optical inspection;
> manual fitting of conventional components using the Through-Hole Technology (THT);
> machine-aided ATF 32/40 wave soldering;
> product washing in ultrasonic bath upon customer’s request;
> product testing upon the customer’s testing on supplied testing equipment;
> manual product assembly.
The custom production of electronics uses both lead and lead-free technologies.